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Samsung将投资44.8亿美元在韩国建设HBM封装工厂

来源标题：Samsung to invest $4.48 billion in HBM packaging plant in South Korea

来源 electronics.economictimes.indiatimes.com

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  1. Samsung将投资44.8亿美元在韩国建设HBM封装工厂 Samsung to invest $4.48 billion in HBM packaging plant in South Korea indiatimes.com