三星李在镕称，Onyang园区将成为先进HBM封装关键枢纽
来源标题：Lee Says Samsung's Onyang Campus to Become Key Hub for Advanced HBM Packaging
机器译题：李表示，三星Onyang园区将成为先进HBM封装的关键枢纽
来源标题：Lee Says Samsung's Onyang Campus to Become Key Hub for Advanced HBM Packaging
机器译题：李表示，三星Onyang园区将成为先进HBM封装的关键枢纽