直接液冷下AI加速器中高带宽内存堆栈的热管理
来源标题：Thermal Management of High Bandwidth Memory Stacks in AI Accelerators Under Direct Liquid Cooling
Introduction The rapid increase in power density across artificial intelligence (AI) training and inference hardware has made direct liquid cooling (DLC) the standard thermal solution for high-density AI compute platforms. A single high-performance AI accelerator module now routinely dissipates several […] The post Thermal Management of High Bandwidth Memory Stacks in AI Accelerators Under Direct Liquid Cooling appeared first on Electronics Cooling .