台积电与格罗方德达成20亿美元协议 提升美国中介层产量
TSMC taps GlobalFoundries to boost US interposer output in $2 billion deal
来源 news.lavx.hu
同题报道 · 10 篇
- 台积电与格罗方德达成20亿美元协议 提升美国中介层产量 TSMC taps GlobalFoundries to boost US interposer output in $2 billion deal news.lavx.hu ·
- 台积电与全球晶圆厂签署20亿美元硅中介层供应协议 TSMC Signs $2 Billion Silicon Interposer Supply Deal with US-Based GlobalFoundries marketscreener.com ·
- 格罗方德赢得台积电20亿美元中介层订单 填补美国封装缺口 GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap digitimes ·
- 台积电与格罗方德签署20亿美元硅中介层供应协议 TSMC, GlobalFoundries Ink $2 Billion Silicon Interposer Supply Deal marketscreener.com ·
- 格罗方德获得台积电20亿美元合同，助力美国AI芯片封装 GlobalFoundries Secures $2 Billion TSMC Contract to Boost U.S. AI Chip Packaging BigGo Finance ·
- 格罗方德与台积电达成20亿美元协议 扩大美国AI芯片封装业务 GlobalFoundries Lands $2 Billion TSMC Deal to Expand US AI Chip Packaging Benzinga ·
- 格罗方德与台积电签署美国AI封装制造协议 GlobalFoundries and TSMC Sign US Manufacturing Deal for AI Packaging HPCwire ·
- 台积电与竞争对手格罗方德达成20亿美元协议，基于现有美国中介层生产业务 TSMC’s $2 Billion Deal With Rival GlobalFoundries Builds on Existing US Interposer Production the deep dive ·
- 格罗方德与台积电签署20亿美元协议 — Channel NewsAsia GlobalFoundries signs $2 billion deal with TSMC — Channel NewsAsia UA.NEWS ·
- 格罗方德与台积电签署20亿美元AI芯片制造协议 GlobalFoundries, TSMC Sign $2 Billion AI Chip Manufacturing Deal Global Banking & Finance Review · · 首发